BGA2035 Rework System
Features:
  1. No need for hot air nozzle, no airflow during the reball process, easily accomplished.
  2. Use top open-type dark-infrared heating method, bottom large area method, can decrease the vertical temperature difference between surface and soldering joints and shorten the desoldering time of BGA
  3. Use non-contact infrared temperature sensor to control the temperature, ensure precise temperature window and even heat distribution.
  4. PCB fixture can be moved front, back, right and left easily, easy installation and operation.
  5. IRSOFT interface, with operation right limitation and profile analysis function.

Specifications:
  1. Power: 2200W (Max)
  2. Power of Bottom Heater: 1500W (Infrared heating tube)
  3. Power of Top Heater: 720W (Infrared heating tube, wavelength about 2-8 m, size: 60*60mm)
  4. Bottom Preheat Area: 260*260mm
  5. Max PCB Size: 420mm*500mm
  6. Max BGA Size: 60*60mm
  7. Communication: Standard RS-232C(Connect with PC)
  8. Infrared Temperature Sensor: 0~300C(Temperature Range)
  9. Dimensions: 330*380*440 (MM)
  10. Weight: 20Kg