QK-IR2005 and QK-PL2005 Combo BGA Repair System Sale Price: $14,950.00  This combo BGA rework system contains two items: QK-IR2005 IR hot air rework station and QK-PL2005 vision assisted precision placing table. SMT rework becomes a safe and accurate process with this system. Non-contact infrared monitoring of the rework process for optimum results Closed loop control for accurate heating profiles and even heat distribution No nozzles needed. Adjustable aperture controls heating area and suits large as well as small parts The special reflow process camera(optional) gathers critical in-process information for real time profile adjustment Combo system for easy handling ad set up Works with either lead or lead free solder pasts Suitable for a wide variety of SMD components Low cost and high quality Data sheets: QK-IR2005 QK-PL2005 More Pictures Video QK-IR Rework Station Specifications Model QK-IR2005 QK-IR2005L Power consumption 1535W(max) 2400W(max) Max. PCB 250 x 300 mm (9 7/8"x11 7/8") 300 x 400 mm(11 7/8"x15 3/4") Top heating 4x180W, infrared heating tubes, wavelength: 2~8m μm, size: 60x60mm Top heating time about 10S from room temperature to 230°C Bottom heating 2x400W, size: 135x250mm 4x400W, size: 267x280mm infrared ceramic heating plates Control and video power 15W LCD display 65.7x23.5mm, 16x2 characters Bottom IR preheating time 90S Heat aperture adjustment 20~60mm, adjustable, no nozzles needed Infrared sensor range 0~300°C External K type sensor optional Reflow process camera, RPC2005 optional, 22x10 magnification, 12V/300mA, 480 TV lines Computer interface RS232 standard Dimension 330x380x440mm 350x510x440mm Weight 13Kg 15Kg QK-PL2005 and QK-PL2005L Placing Station Specifications Power consumption 15W Video camera 22x10 magnificaiton, 12V/300mA, horizontal resolution 480 TV lines Placing precision ±0.025mm LED lighting White LED botttom and red LED top, brightness adjustable Vacuum pump 12V/600mA, 0.05Mpa (max.) Weight 22Kg QKBGA 2015 Precision BGA Rework System Sale Price: $18,950.00 Features: 1. IR2015 Infrared Reflow Soldering Section: Infrared temperature sensor monitors BGA surface temperature to ensure precise temperature technical window. Even heat distribution, real closed-loop control. 2. PL2015 Precise Aligning and Placing System: Visible double-color optical alignment. Accurate alignment and overlap between solder ball and soldering pad; Easy to control and place components. 3. RPC2015 Reflow Camera: The melting course of BGA solder ball can be observed from different angles which provides critical information to get accurate and reliable process curve. 4. IRsoft Software: By means of PC, the whole process can be recorded, controlled and analyzed and then g enerate the curve diagram to meet the demands of modern electronic industry.