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The system is a combination of high precision pick and place working table,
programmable hot air rework station, preheat hot plate. It can be used to work with BGA and other high density IC chips. The working
table is specailly disigned to place high density chips with precise x,y
and θ adjustment. Align the chip with pads on PCB boards carefully,
turn the vacuum off to let the chip drop onto the circuit board. The programmable
hot air rework station is a must for BGA chip installation with accurate
temperature and time control.
Specifications:
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X,
Y and theta
adjustable in fine steps for accurate alignment of BGA and
other fine pitch chips.
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Programmable
hot air rework station. Can be set as automatic/manual
modes.
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40
default profiles/10 user defined profiles.
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External
temperature sensor for accurate temperature
control/adjustment.
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Built
in vaccum nozzle for automatic/manual chip pick
up/release.
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Self-protection
functions.
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Temperature:
100-600
C.
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Timer:
15-999s.
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Air
pump: 0.7-27L/min.
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Weight: 55.0 lbs.
The
system includes:
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High precision fixture: 301X.
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Programmable hot air rework station: 852D.
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Hotplate: 863, controled by 852D.
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12 BGA nozzles.
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Hot tweezers and solder iron combo: 933D.
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