The system is a combination of high precision pick and place working table,
programmable hot air rework station, preheat hot plate. It can be used to work with BGA and other high density IC chips. The working
table is specailly disigned to place high density chips with precise x,y
and θ adjustment. Align the chip with pads on PCB boards carefully,
turn the vacuum off to let the chip drop onto the circuit board. The programmable
hot air rework station is a must for BGA chip installation with accurate
temperature and time control.
Specifications:
Operating voltage: 220V 50/60Hz
Temperature control mode: high-precision closed loop control K-type thermocoupler
Temperature: 0-400°C
Top heater power: 750 W
Bottom heater power: 750 W
Total power: 2000 W
PCB size: 85x85mm min, 550x375mm max
Dimensions: 600mm (length) x 620mm (width) x 600mm (height)
Weight: ~75kg
Weldable chip size: 5x5mm/45x45mm
Nozzle size: 5 sizes for upper part of heating network
