Sale Price: $212.00
Built in air pump. No need for external
compressed air source.
and air pressure controlled separately.
air temperature: 50°C to 550°C.
soft hot air for even heat spreading.
Hot air volume 400L/minute(Max.)
heating up, reaches to the specified temperature in just
for working with BGA chips also.
Automatic on/off switch in the handle.
the flat side of the handle on the table, it turns the
heat off and lowers the air pressure to an idle state.
This tool is good for big as well as small components. No need for many
nozzles. One nozzle fits almost all jobs.
110V power supply, 1400W power consumption.
Dimensions: 180(W)x140(H)x200(D)mm, weight: 3Kg.
Handle diameter 2 1/2", length 8 1/2".
Comes with two hot air nozzles.
Safe for the components and PCB boards as well.
Additional hot air nozzles can be purchased here.